Cost-effective high-frequency packaging

Patent Name Cost-effective high-frequency packaging patent applicants Siemens AG's main applicant address G. Schmidt, inventor of Munich, Germany; K. Weidner; J. Chapf Application (patent) No. 200480000842.1 Date of application: 2004.06.29 Date of Approval Audit No. 1701440 Date of Validation Notice 2005.11.23 Manual CD-ROM D0547 Main Classification No. H01L23/552 Classification No. H01L23/552; H01L23/31; H01L21/50 Original Application No. 2001.3.30 DE 10329329.9 Abstract A high-frequency package is produced, a component being connected to a circuit carrier via contacts, the contacts separating the component from the circuit carrier, and applying a thin film on the component and the circuit carrier. The film is metallized. Sovereignty item 1. A method in which a circuit carrier (3) is connected to a component (1) via a contact (2) which spaces the component (1) from the circuit carrier (3). - A film (5) is applied to the component (1) and the circuit carrier (3), the film (5) being metallized. International Application 2004-06-29 PCT/EP2004/051282 International Publication 2005-01-06 WO2005/001934 German